发明名称 PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a package which enables a problem of increasing cost of a traditional package due to enlarging its size for mounting many through- holes for GND between lines to prevent coupling between biases and control lines which are wired in the package. SOLUTION: A resistance is applied on biases and control lines which are wired within a package, and the high frequency component passing the biases and control lines is suppressed. Thus, the coupling quantity between biases and control lines is suppressed, and the number of through-holes for GND that are mounted between the lines are cut to miniaturize and make the package price lower.
申请公布号 JP2002083895(A) 申请公布日期 2002.03.22
申请号 JP20010200919 申请日期 2001.07.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAMAKI TSUTOMU;SUZUKI TAKUYA;MATSUO KOICHI;FURUYA TERUO
分类号 H01L23/12;H01P1/00;(IPC1-7):H01L23/12 主分类号 H01L23/12
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