| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor package for manufacturing the semiconductor package of the same size as a semiconductor chip at a low cost. SOLUTION: A copper foil 1 with a photosensitive insulation resin is laminated on a semiconductor wafer 10, the copper foil 1 is etched by a metal resist 12 to form a circuit 13, and after the formed circuit is buried in the photosensitive insulation resin 2, wire bond opening parts are collectively formed by mask- exposing, developing and curing the photosensitive insulation resin 2. |
