| 摘要 |
PROBLEM TO BE SOLVED: To provide a diamond cutter very thin in thickness and capable of highly precisely cutting without causing seizure and burnt cracking. SOLUTION: A diamond layer 3 is provided on an outer periphery of a substrate 1 which is a thin disc, thickness of the diamond layer 3 is made slightly larger than that of the substrate, and a spiral groove 4 is formed on a surface of the substrate 1. |
