发明名称 Conductive curable composition
摘要 The present invention is a silicone conductive sponge or foam (open cell) which is arrived at through a two-part addition cured silicone system. When combined with equal parts of "A" and "B", the system will sponge or foam by heat or at room temperature. A conductive metal is added in concentrations to the system of about 65%-72%, and more preferably in concentrations of 66%-67%. When a sponge sheet stock is formed, the material will sponge 3 to 4 times its original thickness.
申请公布号 US2002022136(A1) 申请公布日期 2002.02.21
申请号 US20010934368 申请日期 2001.08.21
申请人 VALADE JOSEPH A.;REO NED J. 发明人 VALADE JOSEPH A.;REO NED J.
分类号 C08L83/04;(IPC1-7):B32B9/04;C08G77/00 主分类号 C08L83/04
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