发明名称 |
Conductive curable composition |
摘要 |
The present invention is a silicone conductive sponge or foam (open cell) which is arrived at through a two-part addition cured silicone system. When combined with equal parts of "A" and "B", the system will sponge or foam by heat or at room temperature. A conductive metal is added in concentrations to the system of about 65%-72%, and more preferably in concentrations of 66%-67%. When a sponge sheet stock is formed, the material will sponge 3 to 4 times its original thickness.
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申请公布号 |
US2002022136(A1) |
申请公布日期 |
2002.02.21 |
申请号 |
US20010934368 |
申请日期 |
2001.08.21 |
申请人 |
VALADE JOSEPH A.;REO NED J. |
发明人 |
VALADE JOSEPH A.;REO NED J. |
分类号 |
C08L83/04;(IPC1-7):B32B9/04;C08G77/00 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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