SUBSTRATE RINSE LIQUID AND SUBSTRATE TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide substrate rinse liquid which restrains attaching of metals during ultra-pure water rinse of a substrate, where a metallic wiring is formed, and to provide a substrate washing treatment method for restraining attaching of the metals. SOLUTION: The substrate rinse liquid consists of ultra-pure water, comprising chelating agent of free acid or ammonium salt at 100 mg/L or less. After a treatment including a process for making chemical or abrasive liquid function is performed for the surface of a substrate, the substrate is rotated and rinse treatment for removing chemical or contaminant from the surface is applied by means of substrate rinse liquid consisting of ultra-pure water comprising chelating agent of free acid or ammonium salt.