发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress thermocouples used in a semiconductor manufacturing device from deteriorating due to the repetition of a temperature change, to prolong the life of the thermocouples themselves, and to improve the quality of a semiconductor element. SOLUTION: The semiconductor manufacturing device is provided with a reactor core pipe 9 where a semiconductor wafer 5 is loaded inside, reaction gas is introduced and heat treatment is performed at a setting temperature, heat treatment heaters 3 which surround the reactor core pipe 9 and are divided into plural heaters and the respective thermocouples 4, which are installed for the divided heat treatment heaters 3 and control the temperature of the heat treatment heaters 3. A small cylindrical thermal heater 10, for thermally controlling the thermocouples 4 themselves are installed for the respective thermocouples 4 apart from the heat treatment heaters 3, so that the tip parts of the thermocouples are surrounded.
申请公布号 JP2002050581(A) 申请公布日期 2002.02.15
申请号 JP20000233605 申请日期 2000.08.01
申请人 NEC KYUSHU LTD 发明人 TOKUSHIGE KAZUYA
分类号 H01L21/302;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 H01L21/302
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