| 发明名称 |
Semiconductor memory device |
| 摘要 |
In the package, a semiconductor chip is accommodated. This semiconductor chip has n pads (n is a natural number). The package has n pins connected to n pads.
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| 申请公布号 |
US2002012263(A1) |
申请公布日期 |
2002.01.31 |
| 申请号 |
US20010910603 |
申请日期 |
2001.07.19 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OHSHIMA SHIGEO;WATANABE NOBUO |
| 分类号 |
G11C11/401;G11C5/06;G11C29/34;(IPC1-7):G11C5/02 |
主分类号 |
G11C11/401 |
| 代理机构 |
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