发明名称 METHOD OF MANUFACTURING WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To prevent the defective shape of wiring boards from being formed due to burrs on the boards, a break in the boards, and the like when a ceramic board is split into the individual wiring boards. SOLUTION: One ceramic board 10 is cut along split grooves 5 and is separated into a multitude of wiring boards 8 and the multitude of the wiring boards 8 are formed. Metal parts 9 are formed along the grooves 5 at the positions in the vicinities of the regions directly under the grooves 5 in the interior of the board 10.
申请公布号 JP2001358430(A) 申请公布日期 2001.12.26
申请号 JP20000178617 申请日期 2000.06.14
申请人 KYOCERA CORP 发明人 MATSUDERA HIROSHI
分类号 H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K3/00 主分类号 H05K1/02
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