发明名称 METHOD FOR REPAIRING SEED LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method for restoring a seed layer which removes a formed oxide surface, does not require the additional use of metal, lowers or eliminates discontinuity by promoting the increase of the seed layer in its transverse direction and is suitable for a commercial metal deposition method. SOLUTION: The method for providing the metal seed layer substantially free of the discontinuity arranged on a substrate includes bringing the seed layer arranged on the substrate into contact with an acidic electrolytic bath and applying current density of a range up to about 0.1 A/cm2 to the bath. The acidic electrolytic bath includes one or more acids, one or more copper compounds, one or more suppressing materials and water and the acidic electrolytic bath does not contain promoting materials.
申请公布号 JP2001240995(A) 申请公布日期 2001.09.04
申请号 JP20000382506 申请日期 2000.12.15
申请人 SHIPLEY CO LLC 发明人 MORRISSEY DENIS;MERRICKS DAVID;BARSTAD LEON R;STEP EUGENE N;CALVERT JEFFREY M;SCHETTY ROBERT A III;SHELNUT JAMES G;LEFEBVRE MARK;BAYES MARTIN W;STORJOHANN DONALD E
分类号 H01L21/28;C25D3/38;C25D5/34;C25D7/12;H01L21/288;(IPC1-7):C25D5/34 主分类号 H01L21/28
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