| 摘要 |
PROBLEM TO BE SOLVED: To easily supply a moisture to a process gas in a vaporized state with a simple apparatus in the case of variously surface treating the surface of a semiconductor substrate of a silicon wafer or the like, by the gas supplied by a process gas supply conduit 2 in a vacuum container 1. SOLUTION: Water fed from a water supply conduit 5 is controlled to be specified in a suitable amount via a flow rate control valve 8 in the conduit 2, and then injection from a water injection nozzle 4.
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