| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat exchanging between a printed-circuit board and a sole plate, using a simple structure and at a low cost. SOLUTION: A heat-conductive electrical insulating material 6 is arranged in a region to the support surface of a sole plate 1, the material is pinched between a printed circuit board 2 and the sole plate 1, and compressive stress is applied to the heat-conductive and electrically insulating material 6 by the printed circuit board 2 and the sole plate 1.
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