| 摘要 |
PROBLEM TO BE SOLVED: To provide cured products having low hygroscopicity and low thermal expansion which are suitable for coating, sealing and insulating electrical parts and electronic parts. SOLUTION: The cured products of thermosetting resins are obtained by curing a composition comprising, as the essential components, (A) an aromatic episulfide compound of the formula (wherein X is O or S and the ratio of S in X is on the average >=95 mol%; and R1-R4 are each H, a halogen or a lower alkyl group), (B) a curing catalyst, and (C) an initiator to be selected from a thioester compound and a mercapto compound with 0.01-7 pts.wt. components (B) and (C), respectively, based on 100 pts.wt. component (A), at 80-200 deg.C, and have a remaining ratio ofβ-epithiopropyl group of <5% and a glass transition temperature of >=100 deg.C.
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