发明名称 |
SUBSTRATE FIXING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate fixing device capable of efficiently fixing a substrate to a rotated at a high speed. SOLUTION: This substrate fixing device 1 comprises a stage 5 which is rotary driven by a driving device placed with a wafer W (substrate) and fixing pawls 8 which are disposed on the stage 5 on a circle around the center of rotation thereof, retain the peripheral edge of the wafer W and fix the wafer to the stage and fixation releasing devices 9 which release the fixation of the wafer W by operating the fixing pawls 8. The fixing pawls 8 are disposed oscillatably on an approximately perpendicular plane passing the axis O of rotation of the stage 5. The oscillated top ends of the fixing pawls 8 are provided with engaging parts 19 for fixing the peripheral edge of the wafer W by engaging therewith. The fixing pawls 8 are subjected to weight distribution in such a manner that the centroid G thereof exists nearer the center-of-rotation side of the stage 5 than a perpendicular line V down from the center C of oscillation at the oscillated bottom ends.
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申请公布号 |
JP2001070894(A) |
申请公布日期 |
2001.03.21 |
申请号 |
JP19990253285 |
申请日期 |
1999.09.07 |
申请人 |
MITSUBISHI MATERIALS CORP;TAMAGAWA MACHINERY CO LTD |
发明人 |
KOBAYASHI TATSUNOBU;SHIMIZU MAKOTO;SATO HIROSHI |
分类号 |
B08B1/04;B08B3/02;H01L21/304;(IPC1-7):B08B1/04 |
主分类号 |
B08B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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