| 摘要 |
Gluing process for micro-structured substrates. The invention is applicable particularly to the fabrication of micro-fluidic components. In order to glue a micro-structured substrate ( 2 ) having upper coplanar plane areas ( 6 ) and recesses between them, a grid ( 10 ) is placed above the substrate, the grid is coated with a glue ( 12 ), using a tool ( 16 ) that presses on the grid and locally brings it into contact with the areas, so as to deposit a film ( 20 ) of glue droplets on them, and the grid is removed. Furthermore, the upper coplanar plane areas ( 6 ) are treated before the film of glue droplets is deposited, this treatment being designed to adapt wettability of these areas to the glue. |
