| 摘要 |
PROBLEM TO BE SOLVED: To obtain an image sensor of high performance by preventing the reduction of resolution due to stray light or reflected light generated by wire bonding. SOLUTION: The image sensor 16 is constituted that pair chip type CCDs 9, 10 are one-dimensionally arrayed in stagger or steps, superposed parts are formed on respective end parts of the adjacent CCDs 9, 10, driving circuits D1, D2 are connected to respective CCDs 9, 10 and a light source and a lens L are arranged. In this case, a light shielding member S having a slit corresponding to the one-dimensional array is arranged between an original 5 and the lens L or between the lens L and a wired board 7.
|
