METHODS OF WET PROCESSING ELECTRONIC COMPONENTS USING PROCESS LIQUIDS WITH CONTROLLED LEVELS OF GASES

摘要

The present invention is related to wet processing methods for electronic components using process liquids having controlled levels (i.e., amounts) of gases. The present invention provides methods of wet processing where at least two process liquids used during a wet processing procedure contain different levels of gases. Sonic energy may optionally be used in one or more wet process steps of a wet processing procedure to enhance results. The methods of the present invention can result in, for example, improved cleaning or reduced particle contamination during a wet processing procedure.