| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for mounting an IC chip on a circuit board, whereby the IC chip is bonded at a good productivity and a high reliability. SOLUTION: For mounting an IC chip 2 on a circuit board 4, bumps 3 are formed on electrodes 2 on the chip, an insulating thermosetting resin 6 having no conductive grains is inserted between the electrodes of the circuit board and the bumps, the bumps are aligned with the electrodes on the circuit board, the IC chip is pressed to the circuit board by a heated head 8 to straighten the IC chip and the board which are warped and to cure the resin interposed between the IC chip and the circuit board at the same time, thus bonding the IC chip to the board. |
