| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject encapsulant capable of forming collective bumping holes by a photolithographic method and exhibiting excellent resolution, adhesion, etc., by using a specific high-energy ray photosensitive cationic curing type encapsulant. SOLUTION: This encapsulant comprises (A) a high-energy ray photosensitive cationic curing type resin, (B) a cationc photopolymerization initiator and (C) a curing component. The component A is preferably a reactional product of a reactional product of an epoxy resin having at least >=2 epoxy groups in the molecule (preferably an epoxy resin which is a reactional product of a bisphenol type epoxy resin with an epihalohydrin and having 280-500 g/equivalent epoxy equivalent or the like) with an alcoholic hydroxyl group-containing monocarboxylic acid compound (preferably dimethylolpropionic acid or the like) with a polybasic acid anhydride (preferably succinic anhydride or the like). The encapsulant can be used to simultaneously carry out connection and sealing in substrate packaging of flip-chips.
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