发明名称 HEADER ASSEMBLY MOUNTED ON CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a header assembly storing a multiplicity of pairs of differential signal wires in a relatively high density, and also having grounded shields for signal pins. SOLUTION: This header assembly 10 is mounted on a back plane 12 and receives an auxiliary electrical connector. The header assembly 10 is equipped with an insulating shroud 14 with a base 16 having a back plane side 22, a connector side 20, and a main edge 23, pairs 24p of differential signal pins 24a, 24b mounted on the base, grounded shields 26, and grounded pins 28. The pairs of signal pins are disposed in rows extending in the first direction R along the base and along the main edge of the base, and disposed in columns extending in the perpendicular second direction C along the base. The signal pins of each pair are disposed next to each other in sub-rows extending in the first direction. Each signal pin is associated with one grounded shield. The grounded shields are so combined as to electromagnetically isolate substantially completely each pair of signal pins from all the other pairs. Each grounded pin makes electrical contact by its second wing with a grounded shield.</p>
申请公布号 JP2000348824(A) 申请公布日期 2000.12.15
申请号 JP20000132531 申请日期 2000.05.01
申请人 BERG TECHNOL INC 发明人 ORTEGA JOSE L;STONER STUART C;RAISTRICK ALAN
分类号 H01R13/652;H01R12/50;H01R13/6585;(IPC1-7):H01R13/652;H01R12/06;H01R12/16 主分类号 H01R13/652
代理机构 代理人
主权项
地址