发明名称 PRODUCTION OF REFLOW TINNED PLATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To uniformize the thickness of a plating layer and to make excellent the surface glosiness and solder wettability in the material by introducing a plated material obtd. by forming a tinning or tin alloy plating layer on a metallic wire or strip into a heating furnace, heating and melting the tinning or tin alloy plating layer and next cooling and solidifying the tinning or tin alloy plating layer by a driving part of water cooled rolls. SOLUTION: The metallic wire or strip is composed of copper, a copper alloy such as phosphor bronze, steel, or the like. The plated material 2 is introduced into a heating furnace 3, and the tinning or tin alloy plating layer is heated and melted. The heating means is not particularly limited, and radiation heating, resistance heating, high-frequency heating, or the like, is adopted. Next, the melted plated material 2 is passed through a space between a driving pair of water-cooled rolls 4a and 4b, by which the tinning or tin alloy plating layer is cooled and solidified. As the driving pair of water-cooled rolls 4a and 4b, a double tube system in which water is circulated through the inside is usual. The plated material is applied with weak pressure to smoothen the thickness of the plating layer, and simultaneously, rapid cooling is executed.
申请公布号 JP2000345388(A) 申请公布日期 2000.12.12
申请号 JP19990159870 申请日期 1999.06.07
申请人 MITANI SHINDO KK 发明人 KITAKATA MITSURU;MATSUMOTO AKIHIRO
分类号 C25D5/50;(IPC1-7):C25D5/50 主分类号 C25D5/50
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