| 摘要 |
PURPOSE: An apparatus for eliminating photoresist is provided to shorten a manufacturing time by embodying a high ashing rate by a high temperature heat treatment when the photoresist is eliminated after a pattern is formed by a photo process and an etching process. CONSTITUTION: An apparatus for eliminating photoresist has a reaction pipe(1), a gas injecting unit(2), a gas exhausting unit(3) and a heater(5). The reaction pipe includes an outer tube(1a) and an inner tube(1b) to evaporate an evaporation layer on a wafer at a constant temperature and under a constant pressure. The gas injecting unit supplies an evaporation gas to the inside of a lower part of the inner tube. The gas exhausting unit exhausts the evaporation gas, connected to the outer tube in the opposite side of the gas injecting unit. The heater increases the temperature of the reaction pipe to a predetermined temperature, adhered on the outer tube. The apparatus for eliminating photoresist comprises a controller(10) which controls a caloric value of the heater to increase and maintain the temperature of the reaction pipe.
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