发明名称 REACTIVE INJECTION MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To make it possible to shorten a time requiring for molding in one cycle and enhance a productivity by improving the temperature responsiveness in a mold relating to the temperature adjustment of the mold. SOLUTION: This mold consists of a male mold 1 and a female mold 2. The female mold 2 is composed of a surfacing layer 5 made of metal and a reinforcing layer 6 for reinforcing the surfacing layer 5. Piping 4 for circulating a heating medium therethrough is provided in the reinforcing layer 6 near the surfacing layer 5 and the piping 4 and the surfacing layer 5 and bonded together with soldering material. Thus, the temperature of the heating medium in the piping is rapidly conducted to the surfacing layer, thereby improving a temperature responsiveness.
申请公布号 JP2000185336(A) 申请公布日期 2000.07.04
申请号 JP19980365946 申请日期 1998.12.24
申请人 HITACHI CHEM CO LTD 发明人 HIRAKAWA MASAYA;TAKAHASHI KATSUHIRO
分类号 B29C33/04;B29C33/38;B29C45/00;B29C45/26;B29C45/73;(IPC1-7):B29C45/26 主分类号 B29C33/04
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