发明名称 |
REACTIVE INJECTION MOLDING DIE |
摘要 |
PROBLEM TO BE SOLVED: To make it possible to shorten a time requiring for molding in one cycle and enhance a productivity by improving the temperature responsiveness in a mold relating to the temperature adjustment of the mold. SOLUTION: This mold consists of a male mold 1 and a female mold 2. The female mold 2 is composed of a surfacing layer 5 made of metal and a reinforcing layer 6 for reinforcing the surfacing layer 5. Piping 4 for circulating a heating medium therethrough is provided in the reinforcing layer 6 near the surfacing layer 5 and the piping 4 and the surfacing layer 5 and bonded together with soldering material. Thus, the temperature of the heating medium in the piping is rapidly conducted to the surfacing layer, thereby improving a temperature responsiveness.
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申请公布号 |
JP2000185336(A) |
申请公布日期 |
2000.07.04 |
申请号 |
JP19980365946 |
申请日期 |
1998.12.24 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
HIRAKAWA MASAYA;TAKAHASHI KATSUHIRO |
分类号 |
B29C33/04;B29C33/38;B29C45/00;B29C45/26;B29C45/73;(IPC1-7):B29C45/26 |
主分类号 |
B29C33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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