发明名称 SILICON CARBIDE ASSEMBLING WAFER BOAT FOR SEMICONDUCTOR MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To obtain a silicon carbide assembling wafer boat for semiconductor manufacture, wherein constituent components are easy to be replaced, damages are not caused by thermal stresses during heat treatment, long term usage is possible, and no particle contamination occurs to a semiconductor manufacturing apparatus and a semiconductor wafer. SOLUTION: A silicon carbide assembling wafer boat for semiconductor manufacture comprising silicon carbide wafer holding members 5, wherein grooves 2 for receiving semiconductor wafers are formed and locking parts 4 are provided at both ends 3 thereof, and two support silicon carbide base plates 7, 8, wherein affixing holes 6 for fixing the wafer holding members 5 are provided respectively, assembled by engaging silicon carbide engaging bodies 9 with the locking parts 4 passed through the affixing holes 6, wherein taper is formed in the engaging surface 10 of the engaging body and further the base members 5, 7, 8 and the locking body 9 are coated with a CVD-SiC film.</p>
申请公布号 JP2000164522(A) 申请公布日期 2000.06.16
申请号 JP19980334601 申请日期 1998.11.25
申请人 TOSHIBA CERAMICS CO LTD;NICHIYUU DENSHI KK 发明人 KITAZAWA ATSUO;TABEI TAKAHIRO;ITO TAKAO;NOGUCHI KENSAKU
分类号 H01L21/683;C30B25/12;H01L21/22;H01L21/68;(IPC1-7):H01L21/22 主分类号 H01L21/683
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