| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer chamfering device which efficiently cleans a wafer before, during or after chamfering and a chuck table. SOLUTION: A cleaning brush 96 which reciprocates along the upper surface of a chuck table 76 is provided. When a wafer W to be chamfered is conveyed to the upper surface of the chuck table 76, the brush reciprocates along the upper surface of the chuck table 76. The brush 96 oscillates on the rear surface of the wafer W and the upper surface of the chuck table 76. As a result, the rear surface of the wafer W and the upper surface of the chuck table 76 are brush-cleaned.
|
