The replaceable power module includes a power section positioned between a cover and a frame. The cover is provided with clips to permit the attachment and detachment of the cover to the base as well the attachment and detachment of the power module to a surface mounted integrated circuit. The frame is provided with an opening for receiving the integrated circuit, and electrical contacts for electrically connecting the power module to the leads of an integrated circuit. The power section is electrically coupled to the frame and includes a battery and a crystal oscillator for controlling the integrated circuit.
申请公布号
US6020634(A)
申请公布日期
2000.02.01
申请号
US19980135197
申请日期
1998.08.17
申请人
DALLAS SEMICONDUCTOR CORPORATION
发明人
GERBER, MARK A.;STRITTMATTER, MICHAEL K.;MCLELLAN, NEIL;HUNDT, JOSEPH P.