发明名称 Heating device for semiconductor wafers
摘要 An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. The light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.
申请公布号 US5970214(A) 申请公布日期 1999.10.19
申请号 US19980078856 申请日期 1998.05.14
申请人 AG ASSOCIATES 发明人 GAT, ARNON
分类号 C30B25/10;C30B31/12;H01L21/00;(IPC1-7):C23C16/00;H05B35/00;F27B5/14;F27D11/02 主分类号 C30B25/10
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