| 摘要 |
PURPOSE:To provide a non-cleaning soldering method, which can eliminate environmental problems, such as the of an ozone layer, and at the same time, to contrive the improvement of productivity and the simplification of an equipment to reduce cost and can secure a highly reliably solder connection, and the non-cleaning soldering device. CONSTITUTION:A non-cleaning soldering method is performed by such a method that a printed-wiring board 1 is housed in a chamber 2, in which an atmosphere isolated from oxygen is formed, the surface of a solder 7 is irradiated with a laser beam 3 to melt a surface oxide film 7 of the solder, this film 7 is evaporated and is removed, leads of a chip component are placed on a circuit pattern 8 to reflow-solder holding a state that the surface oxide film 7 of this solder 7 is removed and the leads can be soldered without using a flux which is required for reducing the film 9. |
