| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a film forming device in which damage is not generated in a substrate as the body to be film-formed and to provide a film forming method. SOLUTION: A pin 5 with a taper shape whose tip is pointed and geared with a lift pin 4 lifting and lowering a substrate 1 loaded on a stage 2 of a film forming device is disposed at a position so as to be inserted into the space between the substrate 1 to be loaded on the stage 2 and a substrate receiving pin 3. Then, before the lift pin 4 for raising the substrate 1 after film formation is brought into contact with the substrate 1, the pin 5 is inserted into the space between the substrate 1 and the substrate receiving pin 3, and the substrate 1 is moved in a direction in which it parts from the substrate receiving pin 3, by which, in a state in which the substrate 1 and the substrate receiving pin 3 are parted, the substrate 1 is lifted by the lift pin 4.</p> |
