ELECTROSTATIC CLOSE ADHESION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electrostatic close adhesion device having bound foams substantially reduced comparing with an electrostatic close adhesion device in a conventional art. SOLUTION: The electrostatic close adhesion device includes a voltage applicable electrode disposed parallel to and in the vicinity of a takeup roller 1, and causes a film 3 extruded from a slot die 2 to be close adhered onto the electrostatic close adhesion device, in which the electrode comprises at least a metal strip electrode 5 having an tapered acute strip edge toward the surface of the takeup roller 1 and a metal strip electrode (8 or) 27 having no tapered acute strip edge; herein the metal strip electrode 5 and the metal strip electrode (8 or) 27 are connected to separate electric power sources 25 and 26, respectively.