Carrier element for semiconductor chip card data type carrier

摘要

The carrier element has several electrically conductive contact tabs (1,1a) insulated from each other by slots (2). The contact tabs are formed of copper. The copper is provided with a surface refining layer of silver and a second surface refining layer of palladium. The contact tabs may be provided with a third silver layer in regions provided for contact with bond wires. The first silver layer is preferably 3 micrometers thick. A moulded housing (4) may be formed on the contact tabs to mechanically connect them and to protect a semiconductor chip (3) arranged on one of the contact tabs.