发明名称 METHOD AND EQUIPMENT FOR STICKING FILM
摘要 <p>PROBLEM TO BE SOLVED: To stick a laminate film on a base and to separate it therefrom without conducting a half cut for cutting a photosensitive resin layer in the laminate film. SOLUTION: On the occasion when a photosensitive resin layer of a laminate film 14 is exposed and stuck on a base 20 in film sticking equipment 10, mask materials 30A and 30B are stuck temporarily on areas 20A and 20B in the front and rear ends of the base 20 whereon photosensitive resin does not need to be stuck, and in this state, a translucent support film and the photosensitive resin layer are stuck on the base 20. The mask materials 30A and 30B being raised together with the translucent support film on the exit side of lamination rolls 22A and 22B, the translucent support film is cut together with the photosensitive resin layer by a film cutting device 24 and unnecessary parts thereof and the mask materials 30A and 30B are cut and separated from the base 20.</p>
申请公布号 JPH1134282(A) 申请公布日期 1999.02.09
申请号 JP19970192459 申请日期 1997.07.17
申请人 SOMAR CORP 发明人 KAWAKAMI KOICHI
分类号 B32B37/00;B32B43/00;H05K3/00;(IPC1-7):B32B35/00;B32B31/00 主分类号 B32B37/00
代理机构 代理人
主权项
地址