| 摘要 |
PROBLEM TO BE SOLVED: To accurately and easily measure the height of each solder ball arranged on the rear surface of a BGA(ball grid array). SOLUTION: In a method for measuring height of solder ball, the height Z of each solder ball 4 arranged on the rear surface of a BGA is measured by performing simple arithmetic processing for calculating d×tanθ(=Z) after the distance (d) between the tracks of the split light rays of slit light LC split when the light LC collides with the apex Ka of each ball 4 by scanning the balls 4 with the slit light in the arranging direction of the balls 4 at an angleθand, at the same time, by processing picture signals based on the pictures of the balls 4 taken from the front sides of the balls 4. |
