| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer carrier mechanism capable of smoothly carrying wafers. SOLUTION: A first and a second flow rate adjusters 25, 26 are inserted in a first and a second air flow passages 21, 22 for flowing air to/from a first and a second cylinder chambers 11, 12. When a piston 4b moves to a second stopper 16, a sensor MI2 detects the piston to reach a first displace position 17 near a moving start point, and a second electromagnetic valve 26b opens to increase the moving speed of the piston 4b. When a sensor MS2 detects the piston 4b to reach a second displace position 18 near a moving end point, the valve 26b closes to slow down the piston 4b, thereby moderating the shock of the piston 4b against a second stopper 16. At the time of speed switching, air returns to a buffer tank AT2 to avoid the so-called hammering. |
