| 发明名称 |
Mold for semiconductor packages |
| 摘要 |
An improved mold for forming a semiconductor package, having a molding compound injection gate having a height not greater than the thickness of the lead frame of the semiconductor assembly placed in the mold.
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| 申请公布号 |
US5811132(A) |
申请公布日期 |
1998.09.22 |
| 申请号 |
US19950542011 |
申请日期 |
1995.10.12 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
RHO, HEE SUN;CHOI, HEE KOOK;CHO, IN SIK;PARK, TAE SUNG |
| 分类号 |
B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/14 |
主分类号 |
B29C45/26 |
| 代理机构 |
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代理人 |
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