摘要 |
<p>PROBLEM TO BE SOLVED: To improve response for the temp. control of a wafer. SOLUTION: A wafer W1 exposed to an X-ray L1 is held with a wafer stage in a hermetically sealed exposure chamber 3 and vacuum-chucked by a wafer chuck 10, having an inner piping in which a temp.-adjusting fluid flows to control the temp. of the wafer. This fluid becomes a thermostatic water, due to a second temp.-adjusting unit 14 disposed outside the exposure chamber 3 and a second temp. adjusting unit 15 integrated with the wafer chuck 10 which finely adjusts the thermostatic water.</p> |