发明名称 HEAT TRANSPORT SYSTEM
摘要 <p>A heat exchanger (1) on the secondary heat source, which exchanges heat with a heat exchanger (12) on the primary heat source in a primary cooling circuit (A), is connected with an indoor heat exchanger (3) through a gas pipe (6) and a liquid pipe (7), which are provided with solenoid valves (SV1, SV2), respectively. Only the solenoid valve (SV2) of the liquid pipe (7) is opened at the time of heat radiation of the heat exchanger (12) on the primary side and the liquid cooling medium is supplied from the heat exchanger (1) on the secondary side to the indoor heat exchanger (3) by the high vapor pressure of the cooling medium evaporated from the heat exchanger (1). Only the solenoid valve (SV1) of the gas pipe (6) is opened at the time of heat absorption of the heat exchanger (12) and the gas cooling medium is recovered from the indoor heat exchanger (3) to the heat exchanger (1) by the low vapor pressure of the cooling medium condensed by the heat exchanger (1). &lt;IMAGE&gt;</p>
申请公布号 EP0857937(A1) 申请公布日期 1998.08.12
申请号 EP19960935453 申请日期 1996.10.24
申请人 DAIKIN INDUSTRIES, LIMITED 发明人 SADA, SHINRI;HORI, YASUSHI;TANAKA, OSAMU
分类号 F25B1/00;F24F5/00;F25B13/00;F25B25/00;F25D17/02;(IPC1-7):F28D15/02 主分类号 F25B1/00
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