ELECTROLESS NICKEL/GOLD PLATING METHOD AND CERAMIC WIRING SUBSTRATE MANUFACTURED THEREWITH,申请号JP19960309525-传众专利搜索

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发明名称	ELECTROLESS NICKEL/GOLD PLATING METHOD AND CERAMIC WIRING SUBSTRATE MANUFACTURED THEREWITH
摘要
申请公布号	JPH10147885(A)	申请公布日期	1998.06.02
申请号	JP19960309525	申请日期	1996.11.20
申请人	HITACHI LTD	发明人	WATANABE TETSUYA
分类号	C23C18/44;C23C18/50;C23C18/52;H05K3/24;H05K3/38;(IPC1-7):C23C18/50	主分类号	C23C18/44
代理机构		代理人
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