| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce wiring delay and enable a high-speed operation by first using an interlayer connection wiring around a semiconductor chip in a multilayer semiconductor module for the purpose of single-to-multiple connection, and first using an interlayer connection wiring distant from the semiconductor chip for the purpose of one-to-one connection. SOLUTION: When a semiconductor chip 110 is connected to a wiring substrate 120, an input/output pad for single-to-multiple connection is connected to a through hole 130 around the semiconductor chip 110 with wiring 125, and an input/output pad for one-to-one connection is connected to a through hole 140 distant from the semiconductor chip 110 with a wiring 126. Wiring substrates 120 are stacked into a multilayer structure 160 by using connection layers 124. The input/output pad of the semiconductor chip 110 and an input/output terminal 150 are connected with the wirings 125 and 126, the through holes 130 and 140. By this constitution, the wiring delay is reduced, and a high-speed operation of a semiconductor module 100 can be realized.</p> |
