发明名称 COIL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a coil device which allows for strong and reliable wire connection processing, while preventing displacement at the time of mounting.SOLUTION: A first terminal electrode 60 has a rising piece 62 for wire connection being raised integrally from one end of an attachment piece 61 in the longitudinal direction along the side face of a flange in the X axis direction, a connection piece 66 formed integrally on the upper end side of the rising piece for wire connection, and to which the lead 12a of a wire is connected, and a fillet formation piece 69 which is raised integrally from one end in the transverse direction crossing the longitudinal direction of the attachment piece 61 along the side face of a flange 40 in the Y axis direction. The lead 12a of a wire is connected with the connection piece 66, at a temperature of the fusion temperature of a solder fillet, to be formed on the fillet formation piece 69, or more.SELECTED DRAWING: Figure 1A
申请公布号 JP2016134589(A) 申请公布日期 2016.07.25
申请号 JP20150010314 申请日期 2015.01.22
申请人 TDK CORP 发明人 IWATA HIROYUKI;TAKAGI NOBUO;ABE HIROYUKI;SHIMURA KOJI
分类号 H01F27/29;H01F17/04 主分类号 H01F27/29
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