| 摘要 |
PROBLEM TO BE SOLVED: To improve the productivity of a non-defective IC by executing automatically removal of defective stud bumps and rebonding of stud bumps by a method wherein a bump cutting device is provided with a cutting member, which cuts the stud bumps along electrode pads by ultrasonic vibrations, and ultrasonic oscillation units, which impart ultrasonic vibration to the cutting member. SOLUTION: A bump cutting device is provided with a cutting member 19 and ultrasonic oscillation units 7 and 8. The member 19 consists of a blade member 191 and a mounting member 192 and cuts stud bumps formed on electrode pads on a semiconductor chip by ultrasonic vibration along the electrode pads. The units 7 and 8 transmit ultrasonic waves, which are generated from the ultrasonic oscillators 8, to the cutting member 19 via the ultrasonic horns 7. The member 19 generates the ultrasonic waves in the directions shown by arrows 61. Thereby, the cutting of the stud bumps is facilitated and the cutting can be conducted without damaging the element. As a result, an IC of a stable quality can be produced and the enhancement of the productivity of the IC can be contrived. |
