| 摘要 |
In a process for cooling soldered objects, a liquid is applied on the soldered objects and made to evaporate quickly. In a preferred embodiment, the objects soldered in a vapour phase soldering installation are cooled down as soon as they leave the vapour phase by means of the vapour phase soldering liquid. The advantages of the process are that the soldered objects can be cooled much more quickly and that the quality of the soldering joints is improved. |
