发明名称 Dry tape covered laser shock peening
摘要 A method of laser shock peening a metallic part by firing a laser on a laser shock peening surface of the part which has been adhesively covered by tape having an ablative medium, preferably, a self adhering tape with an adhesive layer on one side of an ablative layer and a confinement medium without flowing a confinement curtain of fluid over the surface upon which the laser beam is firing. Continuous movement is provided between the part and the laser beam while continuously firing the laser beam, which repeatably pulses between relatively constant periods, on a laser shock peening surface of the part. Using a laser beam with sufficient power to vaporize the ablative medium so that the pulses form laser beam spots on the surface and a region having deep compressive residual stresses imparted by the laser shock peening process extending into the part from the surface. The confinement medium may be supplied by a single layer of tape having a clear layer over the ablative layer or a thicker lap or thickness of laps of a tape with just an ablative layer wherein the extra thickness provides the confinement medium.
申请公布号 US5674328(A) 申请公布日期 1997.10.07
申请号 US19960638622 申请日期 1996.04.26
申请人 GENERAL ELECTRIC COMPANY 发明人 MANNAVA, SEETHARAMAIAH;YEATON, ROBERT L.;MCDANIEL, ALBERT E.
分类号 B23K26/00;C21D7/06;C21D10/00;C22F3/00;C23C26/00;(IPC1-7):C21D1/09 主分类号 B23K26/00
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