发明名称 Multilayered mold structure for hot surface molding in a short cycle time
摘要 <p>A multilayered insulated mold structure is provided. An insulation layer (22) provided on each of the mold cores retains heat at the molding surface, thereby increasing surface quality of the finished part. The insulating layer has a varying density across its thickness so as to have a low density center region and high density surface regions. By having a relatively low density, the center region of the insulating layer has a low thermal conductivety. Thus, the insulating layer may be made from the same material as the core and still have an acceptable insulating value. The use of the same material for adjacent layers reduces the potential of delamination of the layers. The multilayered mold is compatible with passive or active heating of the molding surface. <IMAGE></p>
申请公布号 EP0505738(B1) 申请公布日期 1997.09.17
申请号 EP19920103034 申请日期 1992.02.24
申请人 GENERAL ELECTRIC COMPANY 发明人 KIM, BANG MO
分类号 B29C33/02;B29C33/38;B29C33/56;B29C35/08;B29C45/37;B29C45/73;(IPC1-7):B29C33/56 主分类号 B29C33/02
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