发明名称 |
MOLDING MATERIAL COMPOSITION AND MOLDED ITEM PRODUCED THEREFROM |
摘要 |
PROBLEM TO BE SOLVED: To provide a molding compsn. which can give a molded item excellent in thermal shock resistance and to provide a molded item produced from the same. SOLUTION: This compsn. gives a molded item which has a thermal shock cycle parameter (Tscr) defined by Tt/(K×E×α) (wherein Tt is tensile absorption energy; K is thermal conductivity; E is tensile modulus; andαis the coefficient of thermal expansion) higher than 40.
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申请公布号 |
JPH09208834(A) |
申请公布日期 |
1997.08.12 |
申请号 |
JP19960020325 |
申请日期 |
1996.02.06 |
申请人 |
DAINIPPON INK & CHEM INC |
发明人 |
HARADA TETSUYA;TOMIYAMA TAKASHI;TONOTANI HIDEJI;SHIONE HIDEKI |
分类号 |
C08K3/00;C08F290/00;C08F299/02;C08F299/04;C08L63/10;C08L67/06;C08L101/00;(IPC1-7):C08L101/00 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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