发明名称 MOLDING MATERIAL COMPOSITION AND MOLDED ITEM PRODUCED THEREFROM
摘要 PROBLEM TO BE SOLVED: To provide a molding compsn. which can give a molded item excellent in thermal shock resistance and to provide a molded item produced from the same. SOLUTION: This compsn. gives a molded item which has a thermal shock cycle parameter (Tscr) defined by Tt/(K×E×α) (wherein Tt is tensile absorption energy; K is thermal conductivity; E is tensile modulus; andαis the coefficient of thermal expansion) higher than 40.
申请公布号 JPH09208834(A) 申请公布日期 1997.08.12
申请号 JP19960020325 申请日期 1996.02.06
申请人 DAINIPPON INK & CHEM INC 发明人 HARADA TETSUYA;TOMIYAMA TAKASHI;TONOTANI HIDEJI;SHIONE HIDEKI
分类号 C08K3/00;C08F290/00;C08F299/02;C08F299/04;C08L63/10;C08L67/06;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08K3/00
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