发明名称 Sputter target manufacturing method for surface coating installations
摘要 A sputter target (1) in a vacuum process chamber incorporates at least one target plate (2) and a base plate (16) carrying this target plate fixed by means of a connector element (14). The opposing circumferential edges of the target plate and the base plate laterally extend over the circumferential region of the connector element positioned between these two plates. As a result, this circumferential region of the connector element remains free from electrical discharges acting on the target (1). Also claimed are a method for manufacture of such a target, and an application of the target for medium-frequency and/or high-frequency PVC sputtering.
申请公布号 DE19602389(A1) 申请公布日期 1997.07.31
申请号 DE19961002389 申请日期 1996.01.24
申请人 LEYBOLD MATERIALS GMBH, 63450 HANAU, DE 发明人 SCHULTHEIS, MARKUS, 36043 FULDA, DE;WEIGERT, MARTIN, DR., 63457 HANAU, DE;STROICZEK, MARTIN, 63486 BRUCHKOEBEL, DE
分类号 C23C14/34;H01J37/34;(IPC1-7):H01J37/34;H05H1/46 主分类号 C23C14/34
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