发明名称 Copper metallizations
摘要 Copper-based metallizations, useful in the electronics art, comprising copper powder and certain alkali metal/lead borosilicate glass powders. The copper and glass may be dispersed in an inert liquid vehicle, printed on a substrate, and fired in a nitrogen atmosphere to produce conductor patterns. Also the resultant fired conductor patterns.
申请公布号 US4070518(A) 申请公布日期 1978.01.24
申请号 US19760732749 申请日期 1976.10.15
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 HOFFMAN, LEWIS CHARLES
分类号 H05K1/09;C03C12/00;H01B1/16;(IPC1-7):H01B1/02 主分类号 H05K1/09
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