发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce the manufacturing cost of an electronic component mounting device and improve the quality and productivity of the electronic component mounting device by providing a transfer part, which transfers an electronic component from a supply part to an alignment part and from the aligning part to a mounting part through a coating part and interlocks with the roller of the coating part. SOLUTION: A suction nozzle 18 provided on a transfer part 19 transfers elements 1 from a line feeder 15 to an aligning part 11 using vacuum. That is, a line of elements 1 are supplied by the line feeder 15 of a supply part 23, transferred to the stopper 13 provided at the leading edge, sucked by the suction nozzle 18 of the transfer part 19 from the stopper and are transferred to the aligning part 11. A suction nozzle 4, which is on the transfer part 19 and uses vacuum, transfers the aligned elements 11 to the board 3 on a mounting part 20 through the coating part 10. A rack 21 meshed with a pinion 22 rotates and drives straight the roller 5, which is provided with a groove and is on the coating part 10, by interlocking the roller 5 with the movement of the suction nozzle 4.
申请公布号 JPH09102662(A) 申请公布日期 1997.04.15
申请号 JP19950261255 申请日期 1995.10.09
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKAGI MASAHIRO
分类号 B23P19/00;H05K1/18;H05K3/30;H05K3/34;H05K13/04 主分类号 B23P19/00
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