| 摘要 |
PROBLEM TO BE SOLVED: To provide a method, which can detect accurately the position of the bonded part of an electronic component using an image processing technique. SOLUTION: An object region of inspection of an electronic component is indexed on the basis of a histogram, which is obtained by processing data on a plane pixel obtained by imaging the bonded part of the component, and at the same time, a change in the luminance of a CCD camera is magnified on the basis of the histogram to form data on the magnification of the luminance, a data processing of the data on the magnification of the luminance is performed on the object region of inspection to make a detailed inspection of the object region of inspection of the component and the position of the bonded part of the component is accurately detected. |
