| 摘要 |
PURPOSE: To provide the vacuum treating method and vacuum treating device capable of reducing the amt. of dust depositing on a body to be treated and capable of increasing yield. CONSTITUTION: A body W to be treated is placed in a vacuum pre-chamber 14 provided in a vacuum treating chamber 10 through a valve 43, the dust in the chamber 14 is electrostatically attracted on a dust attracting body 21 provided on the valve 13 and opposed to the body W, then the valve 13 is opened, and specified treatment is applied to the body W in the chamber 14 from the vacuum treating chamber 10 side. Accordingly, the dust in the chamber 14 is effectively attracted on the attracting body 21 opposed to the body W, the body W is subjected to the specified treatment in the chamber 14 without being transferred to the vacuum treating chamber 10, hence the generation of dust is suppressed, the amt. of dust depositing on the body W is decreased, and yield is increased. |
