| 摘要 |
<p>PURPOSE: To contrive a miniaturization of a display device and a lightening of the device by a method wherein a semiconductor integrated circuit equivalent to a stick crystal circuit is mechanically bonded on the stick crystal substrate of the substrates of the device and after the electrical connection of the integrated circuit with an electric circuit is completed, the stick crystal substrate only is removed from the device. CONSTITUTION: A display device is formed into a structure, wherein the device is provided with an electric circuit 5, a first substrate 1 having a slender semiconductor circuit 2, which is electrically connected with the circuit 5 and has TFTs 12 and 13, and a second substrate 16 and a transparent conductive film on the substrate 16 is made to oppose to the surface formed with an electrical wiring 4 of this substrate 1. The circuit 2 is one that its length is roughly equal to the length of one side of the display surface (that is, a matrix) of the device like the length of a stick crystal circuit and the circuit 2 formed on other substrate other than the first and second substrates of the device is separated from the other substrate and is mounted on the substrate 1. In such the structure, a deforming stress due to the thermal expansion of the substrates is applied uniformly to the whole circuits and it is avoided that the stress concentrates only on a specified place and a defect is generated in the device.</p> |
